Since 2008, Unixplore Electronics has been providing one-stop turnkey manufacture and supply services for high-quality Smart Socket PCBA in China. Our company is certified with ISO9001:2015 and adheres to the PCB assembly standard of IPC-610E.
We want to take this opportunity to introduce you to our high-quality Smart Socket PCBA at Unixplore Electronics. Our primary objective is to make sure that our customers fully comprehend the capabilities and features of our products. We are always eager to partner with our existing and new customers to foster a better future.
The smart socket PCBA(Printed Circuit Board Assembly) is an important part of the smart socket and is mainly responsible for realizing the intelligent control function of the socket. It usually contains circuit components such as a microprocessor, power management module, communication interface, input and output interface, and is responsible for processing user control instructions, monitoring the working status of the socket, and realizing remote control and other functions.
The microprocessor is the core of the circuit board and is responsible for performing various control tasks, such as switch control, timing tasks, communication processing, etc. The power management module is responsible for providing a stable power supply to ensure the normal operation of the circuit board. The communication interface is responsible for communicating with external devices (such as smartphones, computers, etc.) to achieve remote control functions. The input and output interface is responsible for connecting the input and output lines of the socket to realize the power on and off control of electrical equipment.
The design and production of smart socket PCBA need to follow relevant electrical safety and industry standards to ensure product safety and reliability. At the same time, strict testing and verification are also required to ensure that the circuit board can work stably and reliably in various working environments.
In general, the smart socket circuit card is the basis for realizing various functions of the smart socket and is an important part of the smart socket.
Unixplore provides one-stop turn-key service for your Electronic Manufacturing project. Feel free to contact us for your circuit board assembly building, we can make a quotation in 24 hours after we receive your Gerber file and BOM list!
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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