Since 2008, Unixplore Electronics has been providing one-stop turnkey manufacture and supply services for high-quality Audio Converter PCBA in China. The company is certified with ISO9001:2015 and adheres to the PCB assembly standard of IPC-610E.
Unixplore Electronics is an Audio Converter PCBA manufacturers and suppliers in China. We can provide professional service and better price for you. If you interested in Audio Converter PCBA products, please contact us. We follow the principles of assured quality, reasonable price, and enthusiastic service.
Audio converter PCBA refers to a Printed Circuit Board Assembly that integrates audio conversion functions. PCBA is the core component of various electronic products. It is responsible for connecting various electronic devices together so that the electronic products can work properly. In an audio converter, the PCBA may contain key components such as audio processing chips, input and output interfaces, and power management to achieve audio signal conversion and processing functions.
Specifically, the main functions of the audio converter PCBA may include:
Audio signal conversion: Convert the input audio signal to the required output format, such as conversion between analog signals and digital signals, or conversion between different sampling rates and bit rates.
Audio enhancement and optimization: Through the built-in audio processing chip, the audio signal is enhanced, filtered, and noise reduced to improve the sound quality and listening experience.
Interface support: Provides a variety of input and output interfaces, such as USB, Bluetooth, 3.5mm jack, etc., to connect and transmit audio signals with different audio devices.
Power management: Ensure that the audio converter operates at a stable operating voltage and may also have energy saving and overheating protection features.
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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