Since 2008, Unixplore Electronics has been providing one-stop turnkey manufacture and supply services for high-quality bluetooth module PCBA in China. Our company is certified with ISO9001:2015 and adheres to the PCB assembly standard of IPC-610E.
We want to take this opportunity to introduce you to our high-quality Bluetooth module PCBA at Unixplore Electronics. Our primary objective is to make sure that our customers fully comprehend the capabilities and features of our products. We are always eager to partner with our existing and new customers to foster a better future.
The Bluetooth module PCBA is a PCBA board that integrates Bluetooth functionality and is used for short distance wireless communication. It is composed of PCB boards, chips, peripheral components, etc., and is a semi-finished product used to replace data cables for small-scale short-range wireless communication.
The Bluetooth module can be divided into Bluetooth data module and Bluetooth voice module according to their functions. It supports point-to-point and point-to-point communication, wirelessly connecting various data and voice devices in homes or offices into a Pico net. Several pico nets can also be further interconnected to form a distributed network (scatter net), enabling fast and convenient communication between these connected devices.
Unixplore provides one-stop turnkey service for your Electronic Manufacturing project. Feel free to contact us for your circuit board assembly building, we can make a quotation in 24 hours after we receive your Gerber file and BOM list!
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
Delivery Service
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