Unixplore Electronics specializes in one-stop turnkey manufacture and supply for Data Acquisition Card PCBA in China since 2008 with certification of ISO9001:2015 and PCB assembly standard IPC-610E,which is widely used in various industrial control equipments and automation systems.
Unixplore Electronics is proud to offer you Data Acquisition Card PCBA. Our goal is to ensure that our customers are fully aware of our products and their functionality and features. We sincerely invite new and old customers to cooperate with us and move towards a prosperous future together.
Data Acquisition Card PCBA(DAQ PCBA) is a computer peripheral integrated on a printed circuit board (PCB) designed to capture analog signals from a variety of sensors and instruments and convert them into a digital format that a computer can process.
The main functions of the data acquisition card PCBA include:
Signal Capture: Capture analog signals from various devices in the physical world.
Signal conversion: Convert analog signals into digital signals through an internal analog-to-digital converter (ADC).
Data transmission: The converted digital signal is transmitted to the computer through the interface circuit for further analysis and processing.
Data acquisition card PCB Assembly usually includes key components such as analog front-end circuits, analog-to-digital converters, clock circuits, and interface circuits, which work together to achieve accurate collection and conversion of data.
In addition, the performance indicators of the data acquisition card PCBA may include sampling rate, accuracy, number of input channels, input range, signal-to-noise ratio, etc. These parameters will directly affect the effect of data acquisition and conversion.
In general, data acquisition card PCBA plays an important role in industrial control, automation systems, scientific experiments and other fields, and is one of the key components for data collection and processing.
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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