Unixplore Electronics specializes in one-stop turnkey manufacture and supply for Industrial Computer PCBA in China since 2008 with certification of ISO9001:2015 and PCB assembly standard IPC-610E,which is widely used in various industrial control equipments and automation systems.
Unixplore Electronics is proud to offer you Industrial Computer PCBA. Our goal is to ensure that our customers are fully aware of our products and their functionality and features. We sincerely invite new and old customers to cooperate with us and move towards a prosperous future together.
Industrial Computer PCBA refers to the Printed Circuit Board Assembly process of industrial control computers (also called industrial computers). Specifically, it covers all steps of soldering electronic components (such as chips, resistors, capacitors, etc.) to a printed circuit board (PCB). This process is an indispensable part of the manufacturing of industrial control computers. It ensures the correctness and quality of the circuit, thereby ensuring the stable operation of the industrial computer.
In the process of industrial computer PCBA, manufacturing processes such as Surface Mount Technology (SMT) and Wave Soldering Technology are usually involved to ensure that electronic components can be accurately soldered to the circuit board. Additionally, after all assembly is complete, each PCB is fully tested to ensure it is functioning properly.
In general, industrial computer PCBA is an important link in the manufacturing process of industrial computers. It involves the manufacturing of circuit boards, component welding and testing, etc., and is of great significance to ensuring the performance and stability of industrial computers.
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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