Unixplore Electronics specializes in one-stop turnkey manufacture and supply for Industrial Data Acquisition PCBA in China since 2008 with certification of ISO9001:2015 and PCB assembly standard IPC-610E,which is widely used in various industrial control equipments and automation systems.
Unixplore Electronics is proud to offer you Industrial Data Acquisition PCBA. Our goal is to ensure that our customers are fully aware of our products and their functionality and features. We sincerely invite new and old customers to cooperate with us and move towards a prosperous future together.
Industrial data acquisition PCBA is an embedded system that can be installed on industrial automation equipment to collect physical quantities, signals, status and other information, and convert it into digital signals to facilitate subsequent data processing and analysis. This device is usually used in industrial automation control systems and has the following main functions:
Collect signals: Receive analog signals/digital signals from various sensors and instruments, and collect and organize the signals.
Signal processing: Convert the collected signals into digital signals, and perform preprocessing, filtering, amplification, judgment and other processing on the signals to improve the reliability and accuracy of the signals.
Signal output: Output the processed signal to the main control board, industrial computer or other equipment to complete data transmission and storage.
Data communication: Supports multiple communication protocols and interfaces to transmit data to the cloud or other smart devices to achieve more monitoring and analysis operations.
It has industrial-level flexibility and reliability and is generally suitable for data collection, monitoring and control in the industrial field. Because it has a variety of interfaces and communication protocols, it can be connected to many different smart devices and computers, and is suitable for common communication protocols such as Bluetooth, Wi-Fi, Zigbee, and Modbus.
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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