Since 2008, Unixplore Electronics has been providing one-stop turnkey manufacture and supply services for high-quality Lora module PCBA in China. Our company is certified with ISO9001:2015 and adheres to the PCB assembly standard of IPC-610E.
We want to take this opportunity to introduce you to our high-quality Lora module PCBA at Unixplore Electronics. Our primary objective is to make sure that our customers fully comprehend the capabilities and features of our products. We are always eager to partner with our existing and new customers to foster a better future.
The Lora module PCBA is a wireless communication module based on spread spectrum technology, belonging to a type of low-power wide area network (LPWAN). It is adopted and promoted by Semtech in the United States and can operate in free frequency bands such as 433, 868, 915MHz, etc. worldwide.
The biggest feature of the Lora module PCBA is its high sensitivity, long-distance transmission, low power consumption, and the ability to form a large number of network nodes. Its working principle is based on Chirp Spread Spectrum (CSS) modulation technology, which expands the signal on the spectrum, thereby increasing the signal's anti-interference ability and transmission distance. The Lora module transmits data by converting it into a series of frequency extended signals, which are then demodulated and de extended by the receiver to recover the original data.
The Lora module PCBA has the advantages of long-distance communication, low power consumption, and wide coverage, making it suitable for application scenarios that require long-distance communication, such as agriculture, smart cities, and industrial Internet of Things. It can be used for real-time monitoring and remote control of environmental parameters, such as soil moisture, temperature, and lighting. In smart cities, the Lora module can be used to achieve functions such as intelligent parking, intelligent lighting, and environmental monitoring. In the field of industrial Internet of Things, it can be used for device monitoring, remote maintenance, and device diagnosis.
In summary, the Lora module PCBA, as a low-power, long-distance, and wide coverage wireless communication technology, provides an important solution for IoT applications. With the rapid development of the Internet of Things, Lora modules will play a more important role in the future
Unixplore provides one-stop turnkey service for your Electronic Manufacturing project. Feel free to contact us for your circuit board assembly building, we can make a quotation in 24 hours after we receive your Gerber file and BOM list!
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
Delivery Service
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