Selection of copper clad laminate in PCBA processing

1. Definition of copper clad laminate

1.1 Function of copper clad laminate

Copper clad laminate is a material covered with copper foil on the surface of the substrate, used to make printed circuit boards (PCBs), and plays the role of electrical conductivity, thermal conductivity, mechanical support and corrosion protection.

1.2 Classification of copper clad laminate

Single-sided copper clad laminate: copper foil is covered on only one side.

Double-sided copper clad laminate: copper foil is covered on both sides, which can be used to make double-sided circuit boards.

Multi-layer copper clad laminate: formed by laminating multiple layers of copper clad laminate, used to make multi-layer printed circuit boards.

2. Key points for selecting copper clad laminate

2.1 Material selection

Select suitable copper clad laminate materials, including substrate materials and copper foil thickness, taking into account the performance requirements and use environment of the circuit board.

2.2 Copper foil thickness

Select the appropriate copper foil thickness according to the requirements and design requirements of the circuit board, usually including different thicknesses such as 1oz, 2oz, and 3oz.

2.3 Surface treatment

The surface treatment of copper clad laminate is also very important. Common treatment methods include chemical copper plating, tin spraying, gold spraying, etc. Choosing the right treatment method can help improve welding performance and corrosion resistance.

3. Common types and advantages

3.1 FR-4 copper clad laminate

FR-4 is a commonly used substrate material with good mechanical properties and heat resistance, suitable for PCB production of general electronic products.

3.2 High-frequency copper clad laminate

Used for high-frequency circuit design, with low dielectric loss and high signal transmission performance.

3.3 High TG copper clad laminate

It has a higher glass transition temperature (TG value) and better heat resistance, suitable for circuit boards that need to operate in high temperature environments.

4. Advantages of copper clad laminate

4.1 Excellent conductivity

Copper clad laminate has excellent conductivity, which can ensure the stability and reliability of the circuit board.

4.2 Strong mechanical properties

The mechanical strength of copper clad laminate is high, and it can withstand greater mechanical stress and vibration, ensuring the durability of the circuit board.

4.3 Good processability

Copper clad laminates are easy to process and manufacture, and can meet different design requirements and production needs.

Conclusion

In PCBA processing, choosing the right copper clad laminate is crucial to the quality and performance of the circuit board. By considering key points such as material selection, copper foil thickness, and surface treatment, choosing the right type of copper clad laminate can ensure the stability, reliability, and durability of the circuit board, and improve the quality and efficiency of PCBA processing.