Unixplore Electronics is a Chinese company that has been focusing on creating and producing first-class Power Supply PCBA for Automobile rear light since 2008. We have certifications to ISO9001:2015 and IPC-610E PCB assembly standards.
Unixplore Electronics has been dedicated to High quality Power Supply PCBA for Automobile Rear Light design and manufacture since we built in 2011.
A power supply PCBA for automobile rear light is a circuit board that is responsible for providing the power to the rear light of a vehicle.
Typically, an automobile power supply PCBA consists of several components that include a voltage regulator, coupling capacitors, and rectifiers. The voltage regulator is responsible for regulating the voltage of the power delivered to the rear light. This ensures stability of the power supplied to the rear light, regardless of the fluctuations in the voltage of the vehicle's electrical system.
Coupling capacitors help to filter out any unwanted noise and contribute to the stability of the power delivery.
Rectifiers convert the AC (alternating current) power being supplied from the car battery into DC (direct current) power that can be used by the rear light.
Other features may be included in the power supply PCBA to protect the circuit components from voltage spikes and surges.
The power supply PCBA for an automobile rear light is typically designed to withstand the harsh and demanding environment of automotive applications, including wide temperature ranges and continuous vibrations.
The advanced manufacturing techniques and quality control steps involved in producing such power supply PCBAs make them reliable enough to provide power to the automobile rear light with high efficiency, ensuring longevity and durability.
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
Delivery Service
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