Unixplore Electronics is a Chinese company that has been focusing on creating and producing first-class smart blood glucose meter PCBA since 2008. We have certifications to ISO9001:2015 and IPC-610E PCB assembly standards.
Unixplore Electronics has been dedicated to High quality Smart blood glucose meter PCBA design and manufacture since we built in 2011.
To make a Smart Blood Glucose PCBA, you'll need knowledge of electronics design, circuit board layout, and microcontroller programming. Here is a general step-by-step process that can help you get started:
Gather the required components and design tools: Glucose sensor, Microcontroller, Power Supply, LCD display, and other needed components. You will also need a PCB design software.
Design the circuit schematic: Use a PCB design software to create a circuit schematic diagram. This will be the blueprint for the PCB layout.
Layout the PCB: After creating the schematic diagram, use the same PCB design software to layout the components on the PCB board.
Fabricate the PCB: Send your PCB design file to a PCB manufacturer to have it fabricated.
Solder the components: After receiving the bare PCB, solder the components onto it carefully.
Program the microcontroller: Connect the microcontroller to a computer and program it with the hex file to read the glucose sensor data and display it on the LCD screen.
Test the PCB: Once completed, test the PCB to ensure that it is working correctly.
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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