Unixplore Electronics specializes in one-stop turnkey manufacture and supply for Smart Meter PCBA in China since 2008 with certification of ISO9001:2015 and PCB assembly standard IPC-610E,which is widely used in various industrial and domestic smart meter devices.
Unixplore Electronics is proud to offer you Smart Meter PCBA. Our goal is to ensure that our customers are fully aware of our products and their functionality and features. We sincerely invite new and old customers to cooperate with us and move towards a prosperous future together.
Smart meter PCBA refers to the Printed Circuit Board Assembly in smart meters. PCB is a printed circuit board, which is a support for electronic components and a provider of circuit connections for electronic components; and A stands for Assembly, which means that various electronic components, chips and other components are assembled on the PCB board according to the designed circuit diagram. , forming a circuit board with specific functions.
Smart meters are one of the basic devices for data collection in smart grids. In addition to measuring the basic power consumption of traditional electric energy meters, in order to adapt to the use of smart grids and new energy, smart meters also have two-way multiple rate measurement functions. Intelligent functions such as user-side control function, two-way data communication function in multiple data transmission modes, anti-electricity theft function, etc.
Therefore, the smart meter PCBA is an important part to achieve these functions. It carries the core circuit and electronic components of the smart meter and is the key to the normal operation of the smart meter.
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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