Unixplore Electronics is a Chinese company that has been focusing on creating and producing first-class Water Dispenser PCBA for Automobile rear light since 2008. We have certifications to ISO9001:2015 and IPC-610E PCB assembly standards.
Unixplore Electronics has been committed to High quality Water Dispenser PCBA design and manufacture since we built in 2011 with ISO9000 certification and IPC-610E PCB assembly standard.
There are several ways to find a trustworthy manufacturer for water dispenser PCBA. Here are a few steps you can consider:
Research and compare: Start by researching and comparing different manufacturers. Look for companies that specialize in manufacturing water dispenser PCBA and read reviews or testimonials from their previous clients.
Verify credentials: Check the credentials of the manufacturer and ensure that they have the necessary certifications for their products. Verify their license, registration, and quality management system.
Ask for samples: Ask the manufacturer to provide you with samples of their products. Examine the quality of the samples to ensure that they meet your standards.
Request references: Ask the manufacturer to provide you with a list of references from their previous clients. Contact these references to learn more about their experiences working with the manufacturer.
Request a factory tour: If possible, request a factory tour to see their manufacturing process firsthand. This will give you an idea of their facilities and their commitment to quality control.
Negotiate the terms: After you have found a trustworthy manufacturer, negotiate the terms and pricing with them. Make sure that you agree on the payment terms, delivery schedule, and other important details before proceeding with the order.
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
Delivery Service
Payment Options