Medium Frequency Heater PCBA

Unixplore Electronics specializes in one-stop turnkey manufacture and supply for Medium Frequency Heater PCBA in China since 2008 with certification of ISO9001:2015 and PCB assembly standard IPC-610E,which is widely used in various industrial control equipments and automation systems.

Model:UE-132

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Product Description

What is Medium Frequency Heater PCBA?

Unixplore Electronics is proud to offer you Medium Frequency Heater PCBA. Our goal is to ensure that our customers are fully aware of our products and their functionality and features. We sincerely invite new and old customers to cooperate with us and move towards a prosperous future together.

A medium frequency heater PCBA is a type of Printed Circuit Board Assembly that is used in medium frequency induction heating systems. It comprises a variety of components, including microcontrollers, power management components, inductors, capacitors, and other devices. These components work together to regulate the flow of electricity to an induction coil that is used to generate heat.

Medium frequency heaters are commonly used in industrial and manufacturing processes to heat metallic objects such as pipes, wires, and plates. They are efficient, reliable, and capable of producing consistent heating in a variety of applications. The medium-frequency heater PCBA plays an important role in controlling the operation of the heating system and ensuring its safe and reliable operation.

Unixplore provides one-stop TURN-KEY service for your EMS project. Feel free to contact us for your board building, we can make a quotation in 24 hours after we receive your Gerber file and BOM list!

Medium Frequency Heater PCBA Manufacture

* Gerber file and BOM list supplied by client
* Blank PCB made, components purchased by us
* PCB fabrication with parts fully assembled
* 100% Function Tested OK before shipping
* RoHS compliant, Lead-free manufacturing process
* Quick delivery, with independent ESD package
* One stop electronic manufacturing service for PCB design, PCB layout, PCB manufacture, components procurement, PCB SMT and DIP assembly, IC programming, function test, packaging and delivery

Unixplore PCB & PCB Assembly Capability

Parameter	Capability
Layers	1-40 layers
Assembly Type	Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT)
Minimum Component Size	0201(01005 Metric)
Maximum Component Size	2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm)
Component Package Types	BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc.
Minimum Pad Pitch	0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA
Minimum Trace Width	0.10 mm (4 mil)
Minimum Trace Clearance	0.10 mm (4 mil)
Minimum Drill Size	0.15 mm (6 mil)
Maximum Board Size	18 in x 24 in (457 mm x 610 mm)
Board Thickness	0.0078 in (0.2 mm) to 0.236 in (6 mm)
Board Material	CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc.
Surface Finish	OSP, HASL, Flash Gold, ENIG, Gold Finger, etc.
Solder Paste Type	Leaded or Lead-Free
Copper Thickness	0.5OZ – 5 OZ
Assembly Process	Reflow Soldering, Wave Soldering, Manual Soldering
Inspection Methods	Automated Optical Inspection (AOI), X-ray, Visual Inspection
Testing Methods In-House	Functional Test, Probe Test, Aging Test, High and Low Temperature Test
Turnaround Time	Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days
PCB Assembly Standards	ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll

Unixplore Value-Added EMS Service

● IC pre-programming service with file in format of HEX,ELF and BIN.
●Medium Frequency Heater PCBA Function test fixture customized according to client’s test requirements
● Box building service including plastic & metal case mold and part production
● Conformal coating including selective lacquer coating, epoxy resin potting
● Wire harness and cable assembly
● Finished product assembly including box, screen, membrane switch, labelling and customized carton or retail box packing.
● Various third-party tests for PCBA are available upon request
● Product Certification Assistance

PCBA Production Procedure