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In the process of PCBA processing (Printed Circuit Board Assembly), the conductive glue process is an important technology, which plays a key role in circuit connection, conductive repair and electronic component fixation. This article will discuss the conductive glue process in PCBA processing, including its principles, applications, advantages and precautions.

When the semiconductor industry is gradually entering the Post-Moore-era, wide band-gap semiconductors are on the historical stage, which is considered an important area of "exchanging overtaking". It is expected that in 2024, the wide band-gap semiconductor materials represented by SiC and GaN will continue to be applied in scenarios such as communications, new energy vehicles, high -speed rail, satellite communications, aerospace and other scenarios, and will be used. The application market achieves rapidly. The maximum application market for silicon carbide (SiC) devices is in new energy vehicles, and it is expected to open the tens of billions of markets. The ultimate performance of the silicon base is better than the silicon substrate, which can meet the application requirements under the conditions such as

Radio frequency interference (RFI) is a common problem in PCBA processing, especially for electronic devices containing radio frequency circuits. To ensure the performance and reliability of electronic devices, a series of strategies are needed to suppress radio frequency interference.

PCBA processing is one of the key links in the modern electronic manufacturing process, and surface coating technology plays an important role in PCBA processing. This article will explore in depth the surface coating technology and its application in PCBA processing.

Modern electronic product design have become far more complex than in the past. In addition to the rise of the Internet of Things (IoT) and the Industrial Internet of Things (IIoT), consumer expectations for the utility, functionality and compatibility of modern electronics are higher than ever. As a result, to remain competitive, designers are forced to add more functionality and more circuitry into a smaller space, while spending significantly less time developing and prototyping.

In PCBA (Printed Circuit Board Assembly) processing, advanced testing equipment is a key tool to ensure product quality and reliability. With the increasing complexity and high performance requirements of electronic products, the technology of testing equipment has also been continuously improved to meet the changing testing needs. This article will explore several advanced testing equipment used in PCBA processing, including their functions, advantages and application scenarios, to help understand how to use these equipment to improve testing efficiency and product quality.