Since 2008, Unixplore Electronics has been providing one-stop turnkey manufacture and supply services for high-quality Smart Weighing Scale PCBA in China. The company is certified with ISO9001:2015 and adheres to the PCB assembly standard of IPC-610E.
If you are looking for a comprehensive selection of Smart Weighing Scale PCBA manufactured in China, Unixplore Electronics is your ultimate source. Their products are priced very competitively and accompanied by top-notch after-sales service. Moreover, they have been actively seeking WIN-WIN collaborative relationships with customers from all over the world.
When designing a smart weighing scale PCBA (Printed Circuit Board Assembly), you need to consider the following aspects:
Hardware design: First, you need to determine the type of sensor to use, such as a pressure sensor to measure weight. The sensor needs to be able to accurately convert body weight into an electrical signal. In addition, a microcontroller (such as an MCU) is required to receive and process these signals, as well as a power module to provide power.
Circuit Design: Design circuit boards to connect sensors, microcontrollers, and other necessary electronic components (such as resistors, capacitors, etc.). Circuits need to be able to accurately pass and process electrical signals.
Software Development: Writing the software that controls the microcontroller. This software needs to be able to read and process the signals from the sensors, convert them into weight readings, and display them on the display. In addition, the software needs to be able to handle other functions such as automatic taring, display accuracy, low-voltage measurement, etc.
Appearance design: Design the appearance of the smart scale, including the location and layout of panels, displays, sensors, etc. The panel needs to be large enough so that the user can stand on it and measure weight. The display needs to be clearly visible so the user can take a weight reading.
Testing and optimization: During the manufacturing process, smart scales need to be tested to ensure their accuracy and reliability. Depending on test results, adjustments and optimizations to hardware, circuitry, or software may be required
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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