Unixplore Electronics specializes in one-stop turnkey manufacture and supply for uninterruptible power supply PCBA in China since 2008 with certification of ISO9001:2015 and PCB assembly standard IPC-610E,which is widely used in various industrial control equipments and automation systems.
Unixplore Electronics is proud to offer you uninterruptible power supply PCBA. Our goal is to ensure that our customers are fully aware of our products and their functionality and features. We sincerely invite new and old customers to cooperate with us and move towards a prosperous future together.
UPS PCBA refers to the main control circuit board or printed circuit board assembly of UPS (uninterruptible power supply) which is a device that provides power backup and stable and uninterrupted power guarantee for key equipment such as computers, servers, and data centers when the main power supply fails.
The UPS PCBA must be efficient, reliable and provide accurate power conversion capabilities to ensure the normal operation of the UPS. It mainly includes the following aspects:
Power management: UPS PCBA needs to be equipped with efficient power management circuits and conversion circuits to ensure high efficiency and high reliability of power conversion by the equipment.
Control function: The UPS PCBA needs to be equipped with a controller that regulates voltage and frequency, and provides a programmable logic controller (PLC) and other control logic to enable the UPS to realize self-diagnosis, protection, automatic shutdown and restart, etc.
Communication interface: The UPS PCBA also needs to be equipped with a communication interface, which can communicate with computers and other equipment to realize UPS status monitoring, control and remote management.
The production and design of UPS PCBA requires precise technology and experience to ensure the reliability, efficiency and stability of the UPS power system.
Parameter | Capability |
Layers | 1-40 layers |
Assembly Type | Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT) |
Minimum Component Size | 0201(01005 Metric) |
Maximum Component Size | 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm) |
Component Package Types | BGA, FBGA, QFN, QFP, VQFN, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, SIP, etc. |
Minimum Pad Pitch | 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA |
Minimum Trace Width | 0.10 mm (4 mil) |
Minimum Trace Clearance | 0.10 mm (4 mil) |
Minimum Drill Size | 0.15 mm (6 mil) |
Maximum Board Size | 18 in x 24 in (457 mm x 610 mm) |
Board Thickness | 0.0078 in (0.2 mm) to 0.236 in (6 mm) |
Board Material | CEM-3,FR-2,FR-4, High-Tg, HDI, Aluminum, High Frequency, FPC, Rigid-Flex, Rogers, etc. |
Surface Finish | OSP, HASL, Flash Gold, ENIG, Gold Finger, etc. |
Solder Paste Type | Leaded or Lead-Free |
Copper Thickness | 0.5OZ – 5 OZ |
Assembly Process | Reflow Soldering, Wave Soldering, Manual Soldering |
Inspection Methods | Automated Optical Inspection (AOI), X-ray, Visual Inspection |
Testing Methods In-House | Functional Test, Probe Test, Aging Test, High and Low Temperature Test |
Turnaround Time | Sampling: 24 hours to 7 days, Mass Run: 10 - 30 days |
PCB Assembly Standards | ISO9001:2015; ROHS, UL 94V0, IPC-610E class ll |
1. Automatic solderpaste printing
2. solderpaste printing done
3. SMT pick and place
4. SMT pick and place done
5. ready for reflow soldering
6. reflow soldering done
7. ready for AOI
8. AOI inspection process
9. THT component placement
10. wave soldering process
11. THT assembly done
12. AOI Inspection for THT assembly
13. IC programming
14. function test
15. QC Check and Repair
16. PCBA conformal coating Process
17. ESD packing
18. Ready for Shipping
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