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During the PCBA assembly process, various common defects may occur. Here are some common PCBA assembly defects and possible solutions:

When the semiconductor industry is gradually entering the Post-Moore-era, wide band-gap semiconductors are on the historical stage, which is considered an important area of "exchanging overtaking". It is expected that in 2024, the wide band-gap semiconductor materials represented by SiC and GaN will continue to be applied in scenarios such as communications, new energy vehicles, high -speed rail, satellite communications, aerospace and other scenarios, and will be used. The application market achieves rapidly. The maximum application market for silicon carbide (SiC) devices is in new energy vehicles, and it is expected to open the tens of billions of markets. The ultimate performance of the silicon base is better than the silicon substrate, which can meet the application requirements under the conditions such as

The thermal management solution in PCBA processing (Printed Circuit Board Assembly) is one of the key factors to ensure the normal operation of electronic products and extend the life of components. This article will discuss the thermal management solution in PCBA processing in detail, including the importance of thermal management, commonly used thermal management technologies and strategies.

In today's electronics industry, PCBA processing is a very important technology. In PCBA processing, surface treatment technology is a crucial link.

In the PCBA processing industry, equipment management is a crucial link. Good equipment management can not only improve production efficiency and reduce costs, but also ensure product quality and production safety. Let's take a look at what equipment management in PCBA processing specifically includes.

As electronic devices become more complex, so do the Printed Circuit Board Assemblies (PCBAs) that power them. Along with advancements in PCBs, the component technologies have also evolved to become disconcertedly compact and intricate. Direct insertion components, in particular, have now become a norm in the electronic manufacturing industry, which demands a higher level of quality control. AOI, an acronym for Automated Optical Inspection, is a non-contact inspection method that can drastically improve the quality of direct insertion component soldering.