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PCBA processing (Printed Circuit Board Assembly) is a crucial part of electronic manufacturing, and electronic testing is one of the indispensable links in the PCBA processing process. This article will discuss electronic testing in PCBA processing, and elaborate on the test methods, test equipment and test processes.

When the semiconductor industry is gradually entering the Post-Moore-era, wide band-gap semiconductors are on the historical stage, which is considered an important area of "exchanging overtaking". It is expected that in 2024, the wide band-gap semiconductor materials represented by SiC and GaN will continue to be applied in scenarios such as communications, new energy vehicles, high -speed rail, satellite communications, aerospace and other scenarios, and will be used. The application market achieves rapidly. The maximum application market for silicon carbide (SiC) devices is in new energy vehicles, and it is expected to open the tens of billions of markets. The ultimate performance of the silicon base is better than the silicon substrate, which can meet the application requirements under the conditions such as

With the continuous popularization of various types of electronic products in the information age, the production scale of printed circuit boards as component carriers is also expanding, and about 18 billion square meters of circuit boards produced around the world each year. And more and more new circuit boards are produced and used, which means that a large number of old circuit boards are scrapped and eliminated. Generally speaking, the circuit board will be processed and recovered.

Flexible electronic circuit board (Flex PCB) is a flexible electronic circuit board usually made of flexible insulating materials such as polyester film or polyimide (PI) film. They offer greater flexibility in bending and shape than traditional rigid circuit boards, making them useful in many applications. The following is information on the design and application of flexible electronic circuit boards:

In PCBA (Printed Circuit Board Assembly) manufacturing, non-destructive testing and quality assurance are key engineering practices to ensure the quality, reliability and performance of circuit boards. Here are the details on both:

Optical microscopy inspection in PCBA processing (Printed Circuit Board Assembly) is a critical quality control step that can effectively detect issues such as component installation, soldering quality, and surface defects on the circuit board. This article will delve into the optical microscopy inspection in PCBA processing, including its role, inspection methods, and advantages.